1.Two-Part Solidified Thermal material
The thermally conductive materials of Spart series is the liquid silica
gel of two-part ceramics gap filler which can be used for cooling
electronic components. It’s a kind of soft and high tenacity elastomer
after curing and will not stress electronic components. At the same
time, the surface jointing more closely with the material can guarantee
the low thermal resistance and is conducive to thermal transmission
between thermal components and peripherals.
Syreln Thermal Clay series is the ideal material for applications where large tolerance differences create the need for compression of interface material beyond 50% of its original thickness. In conjunction with outstanding compression characteristics, Sclay has a high thermal conductivity that results in very low thermal resistance and it is naturally tacky, not requires any further adhesive coating.
3. 5w/mk High thermal conductivity pad
Syreln Spad5000, a thermally conductive filler Spad with high compression stress, has the advantages of high thermal conductivity, low cost and low hardness. With the excellent surface fallibility, this soft thermal conductive material can fit with the assemble component correctly with very little pressure. This material is widely used in Telcome, IT, Power Supply, Electromechanical and Medical Equipment, etc.